Semiconductor Engineering

Chip-Package Co-Analysis Using Ansys RedHawk-CPA

How an integrated chip–package co-analysis can quickly and accurately model package layout for inclusion in on-chip power integrity simulations. Ansys RedHawk-CPA is an integrated chip–package ...
Hosted on MSN

Ansys (ANSS) Unveils Ansys SimAI to Enhance Simulation Dynamics

Ansys ANSS has unveiled its latest artificial intelligence (AI)-driven software, Ansys SimAI, that blends the precision of Ansys simulation with the rapidity of generative AI. Ansys SimAI is a ...
Nasdaq

Ansys Strengthens Collaboration with TSMC on Advanced Node Processes Certification and 3D-IC Multiphysics Design Solutions

To support the increasing demand for scalable electromagnetic analysis, Ansys is introducing a new HFSS-IC product family. HFSS-IC Pro, with RaptorX™ technology embedded, is certified by TSMC for its ...
Seeking Alpha

Ansys 2025 R1 Increases Collaboration, Expands Cloud and AI Functionality, and Delivers Data-Driven Insights with Powerful Digital Engineering Technology

PITTSBURGH, Feb. 4, 2025 /PRNewswire/ -- Ansys (ANSS) (NASDAQ: ANSS) 2025 R1 features refined digital engineering-enabling technologies that easily integrate with existing infrastructure, minimizing ...